1st-of-its-kind 'cooling chip' could prevent AI smartphones from overheating — with 1st devices launching in 2026

For the first time, scientists have packaged a miniscule silicon chip with a cooling system designed to "actively" keep smartphones cool — rather than relying on "passive" cooling and thermal throttling.

The "xMEMS XMC-2400 µCooling" chip is just 0.04 inches (1 millimeter) thick — slightly thicker than a credit card — and is designed to be fitted into ultramobile devices like smartphones and tablets. 

Made in two configurations with vents either on the sides or on the top, the device can shift 2.4 cubic inches (39 cubic centimeters) of air per second while consuming minimal power and making no noise, representatives from xMEMS, a company specializing in chips for speakers, said in a statement. It also generates more "back pressure" than conventional fans, letting it be placed away from an ambient air source.

Unlike conventional fans, it uses a "piezoMEMS transducer" — a device that utilizes the piezoelectric effect, in which a material changes volume (or moves) when a current is applied to it. This comprises tiny silicon structures that oscillate at ultrasonic frequencies to generate air pulses that create airflow. 

There is a rising demand for better cooling as manufacturers integrate artificial intelligence (AI) into new devices. AI increases the demand for computing resources — including more processor cores and onboard memory. In theory, the more powerful future devices are, the hotter they will run.

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Unlike laptops, however, smartphones don't use active cooling systems like fans and instead rely on passive cooling — meaning the heat generated by components dissipates through features like a heat sink — a component designed to absorb any heat generated. For example, the Samsung Galaxy S24 uses a "vapor chamber" while the iPhone 15 Pro uses a large graphite heat spreader to absorb heat.